Teledyne announces Xtium3 PCIe Gen4 frame grabber series for ultra-fast image acquisition

MONTREAL, Dec. 02, 2025 (GLOBE NEWSWIRE) -- Teledyne DALSA, a Teledyne Technologies [NYSE: TDY] company, announces the release of the Xtium™3 PCIe Gen4 family, a next-generation frame grabber engineered to deliver maximum sustained throughput and ready-to-use image data for high-performance industrial applications.

Building on the proven Xtium2 platform, the first model, Xtium3-CLHS PX8 supports the Camera Link HS® (CLHS) standard over the PCI Express™ Gen 4.0 interface. This single-slot, single-cable solution accommodates up to seven CLHS lanes, each operating at 10.3125 Gbps (72.2 Gbps in total), enabling acquisition bandwidths of 8.6 GB/s and host transfer rates of up to 13.2 GB/s via a PCIe Gen4 x8 slot.

Teledyne’s Xtium3 PCIe Gen4 frame grabber series

Key features and benefits:

• High-speed data transmission  ̶ Utilizes CLHS X-protocol with over 97% packet efficiency and 64/66-bit encoding. Supports long cable lengths exceeding 30 meters using 7-lane AOC cables
• Real-time data forwarding  ̶ Redistributes incoming data to up to 12 computers via standard AOC cables for distributed image processing
• Optimized performance  ̶  PCIe Gen4 architecture delivers sustained throughput of 13.2 GB/s directly to host memory, reducing CPU load and accelerating image processing
• Broad compatibility  ̶  Supports area and line scan, monochrome and color cameras, delivering exceptional performance for Camera Link HS (a future model will support CoaXPress®)
• Advanced image processing  ̶  Enables multi-plane HDR processing for Teledyne’s Linea™ HS2 16K camera
• Software support  ̶  Fully compatible with Teledyne’s Sapera™ LT Software SDKs and third-party software for seamless integration.

The Xtium3 series is designed to meet the demands of modern machine vision systems, offering robust performance, scalability, and flexibility for a wide range of industrial applications.

Fully supported by Teledyne’s Sapera LT Software SDKs, the Xtium3 series empowers developers and integrators to build robust, high-speed imaging systems with minimal overhead and maximum flexibility.

For more details, please visit the product page, and for sales enquiries, visit our contact page.

Teledyne Vision Solutions offers the world’s most comprehensive, vertically integrated portfolio of industrial and scientific imaging technology. Aligned under one umbrella, Teledyne DALSA, e2v CMOS image sensors, FLIR IIS, Lumenera, Photometrics, Princeton Instruments, Judson Technologies, Acton Optics, and Adimec form an unrivalled collective of expertise across the spectrum with decades of experience and best-in-class solutions. Together, they combine and leverage each other’s strengths to provide the deepest, widest sensing and related technology portfolio in the world. Teledyne offers worldwide customer support and the technical expertise to handle the toughest tasks. Their tools, technologies, and vision solutions are built to deliver to their customers a unique and competitive advantage.

Media Contact:
Jessica Broom
Jessica.broom@teledyne.com

A photo accompanying this announcement is available at https://www.globenewswire.com/NewsRoom/AttachmentNg/a834e18a-07c3-4500-a00e-14010390bd4f